Tata Electronics has ordered a major redesign of the foundations of its upcoming semiconductor fabrication plant in Gujarat’s Dholera, after fresh assessments revealed that the site’s soil conditions required far more complex engineering than initially planned.
What's the matter? The Rs 91,000-crore project, being built with Taiwan's PSMC, and slated to start chip production by December 2026, sits on reclaimed land with a difficult geological mix.
People aware of the matter said the soil is clay-heavy, saline, silty, and has a low load-bearing capacity.
Semiconductor fabs have strict specifications on vibration and weight distribution, making the base structure critical to long-term stability.
What’s the solution: Tata Electronics has roped in global geo-data specialist Fugro and geotechnical engineering consulting firm Cengers to reassess the terrain and redesign the foundation.
Experts conducted detailed geological tests on the site.
They recommended a revised foundation plan aligned with the technical demands of chip manufacturing.
Construction of the core fab building has since resumed at full pace.
Earlier groundwork will now be repurposed for support structures such as utility blocks and warehouses.
Company’s take: "Given the unique geotechnical conditions of the region, we have prioritised rigorous planning and engaged world-class experts to implement comprehensive design and engineering solutions," the company's spokesperson said in an email statement.
The company reiterated that, despite the redesign, the fab remains on its committed timeline and project execution is back on track.
Source: Economic Times